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Siemens and Intel to Collaborate on Advanced Semiconductor Manufacturing
西門子和英特爾將在先進半導體制造領域展開合作

Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a Memorandum of Understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

領先的科技公司西門子和全球最大的半導體公司之一英特爾公司簽署了一份諒解備忘錄 (MoU)，合作推動微電子制造的數(shù)字化和可持續(xù)發(fā)展。兩家公司將專注于推進未來的制造工作、發(fā)展工廠運營和網絡安全，并支持有韌性的全球行業(yè)生態(tài)系統(tǒng)。

“Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “Our joint efforts will contribute to achieving global sustainability goals.”

“半導體是我們現(xiàn)代經濟的命脈。沒有芯片就沒有什么東西可以運行。因此，我們很自豪能與英特爾合作，快速推進半導體生產。西門子將為此次合作帶來其物聯(lián)網硬件、軟件和電氣設備的全部尖端產品組合，”數(shù)字產業(yè)首席執(zhí)行官兼西門子公司董事會成員Cedrik Neike表示。“我們的共同努力將有助于實現(xiàn)全球可持續(xù)發(fā)展目標。”

The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.

該諒解備忘錄確定了關鍵合作領域，以探索各種舉措，包括優(yōu)化能源管理和解決整個價值鏈的碳足跡。例如，合作將探索使用復雜、資本高度密集的制造設施的“數(shù)字孿生”來標準化解決方案，其中獲得的每一個效率百分比都是有意義的。

The collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product and supply chain related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.

此次合作還將探索通過對整個價值鏈中的自然資源和環(huán)境足跡進行高級建模，最大限度地減少能源使用。為了獲得有關產品相關排放的更多信息，英特爾將與西門子一起探索產品和供應鏈相關的建模解決方案，以推動基于數(shù)據的洞察，幫助行業(yè)加快減少集體足跡的進程。

“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” said Keyvan Esfarjani, Intel executive vice president and chief global operations Officer. “We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities and factory operations. This MOU will benefit regional and global industry value chains.”

英特爾執(zhí)行副總裁兼首席全球運營官Keyvan Esfarjani表示:“世界需要一個更加全球平衡、可持續(xù)和有韌性的半導體供應鏈，以滿足不斷增長的芯片需求。我們很高興能夠通過擴大與西門子的合作，以英特爾先進的制造能力為基礎，探索新的領域，在這些領域，我們可以利用西門子的自動化解決方案組合來提高半導體基礎設施、設施和工廠運營的效率和可持續(xù)性。這份諒解備忘錄將有利于區(qū)域和全球行業(yè)價值鏈。”

Sustainable practices across the entire semiconductor lifecycle, including design, manufacturing, operation, efficiency and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.

整個半導體生命周期（包括設計、制造、運營、效率和回收）的可持續(xù)實踐對于滿足對強大、可持續(xù)芯片不斷增長的需求至關重要。技術可以加速解決方案，以減少整個技術行業(yè)和全球經濟其他領域與計算相關的氣候影響。隨著行業(yè)朝著溫室氣體凈零排放的方向發(fā)展，自動化和數(shù)字化是應對挑戰(zhàn)的關鍵。通過結合各自的優(yōu)勢和專業(yè)知識，西門子和英特爾有望在推動積極變革方面發(fā)揮引領作用。